As ICs have progressed to becoming full systems, such as SOCs (systems on chips), they have been mirroring historical development and design issues that occur in PCB (printed-circuit-board) designs of ...

Siemens adds AI capabilities across EDA portfolio, enhancing productivity, accelerating innovation and speeding time-to-market New AI system enables EDA engineers to leverage AI securely within ...

Flexium Interconnect, a company specializing in flexible PCBs, has disclosed its intention to acquire the outstanding shares of IC design house Rafael Microelectronics for NT$170 (US$5.35) per share.

A new logic-level approach directly impacts board-level performance and complexity. By optimizing interconnects, fanouts and signal structures before schematic capture, a new gate-level synthesis ...

Like other EDA vendors, Siemens EDA has over the past few years been adding artificial intelligence and machine learning capabilities to its suite of EDA (electronic design automation) tools. At the ...

Advanced packaging continues to promise improved form factor, cost, performance, and functionality compared to the traditional transistor scaling on SoCs. This is done by integrating multiple dies on ...

[Hans Rosenberg] knows a thing or two about RF PCB design and has provided a three-part four-part video demonstration of some solid rules of thumb. We will cover the first part here and leave the ...

For many applications, next generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall package size.

6. SOT-23 and SOIC packages are typically used in low-power motor drivers. Standard leaded packages, like SOIC and SOT-23 packages, are often used for low-power motor drivers (Fig. 6). To maximize the ...

The strengths of Taiwan's IC design sector include excellent and dedicated STEM talent, a complete semiconductor industry ecosystem from upstream to downstream, and a well-developed downstream ICT ...

Printed-circuit-board (PCB) substrate material, like FR-4 glass epoxy, is a poor conductor of heat. Conversely, copper is an excellent conductor of heat. So, more copper area on a PCB is ideal from a ...