As ICs have progressed to becoming full systems, such as SOCs (systems on chips), they have been mirroring historical development and design issues that occur in PCB (printed-circuit-board) designs of ...

A new logic-level approach directly impacts board-level performance and complexity. By optimizing interconnects, fanouts and signal structures before schematic capture, a new gate-level synthesis ...

Siemens adds AI capabilities across EDA portfolio, enhancing productivity, accelerating innovation and speeding time-to-market New AI system enables EDA engineers to leverage AI securely within ...

Cadence Design Systems has started bringing artificial intelligence (AI) into the fold on its flagship chip design suite to help designers build smaller, faster processors that consume less power and ...

We have all seen Printed Circuit Board (PCB) antennas: those squiggly bits of traces on PCBs connected often to a Bluetooth, WiFi or other wireless communication chip. On modules like for the ESP8266 ...

Advanced packaging continues to promise improved form factor, cost, performance, and functionality compared to the traditional transistor scaling on SoCs. This is done by integrating multiple dies on ...

For many applications, next generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall package size.

Printed-circuit-board (PCB) substrate material, like FR-4 glass epoxy, is a poor conductor of heat. Conversely, copper is an excellent conductor of heat. So, more copper area on a PCB is ideal from a ...